Keywords
Mini-channel
Flow and heat transfer
Parameter optimization
How to Cite
Abstract
With the rapid development of the electronics industry, the power of devices continues to rise, and seeking more efficient cooling technologies has become a key challenge in various applied scenarios. This study contributes to a novel and efficient heat dissipation method for chips employing liquid metal as a coolant. In this paper, the flow and heat transfer performance of a novel liquid metal (Ga61In25Sn13Zn1) in a mini-channel heat sink is conducted. Using pressure difference, pump power, and total thermal resistance as object parameters, a comprehensive optimization about Hp (channel height), Wc (channel width), Ww (wall thickness), and tb (base thickness) is presented. The optimized parameter combination is Hp = 7 mm, Wc = 0.6 mm, Ww = 0.4 mm, and tb = 0.2 mm. Furthermore, all of the optimization parameters are verified through the design method of orthogonal experiments.
References
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